Product Description
H.D.T (Heat-pipe Direct Touch) technology.
Stealth Technology; Low Heat Signature Ceramic Coating, larger heat dissipating area.
Tower side flow design, efficient and optimal cooling performance.
Anti-vibration rubbers prevent vibration and absorb noise.
Dual fan capability.
Equipped with multiple clips to support Intel LGA 2011/1366/1156/1155/775 and AMD FM2/FM1/AM3+/AM3/AM2+/AM2
High Performance 3 x 8mm heat pipe design, way superior than 4 x 6mm heat pipe.

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